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COB (Chip On Board ): Bonding is the largest production and manufacturing division of Silicon Valley Technology. Bonding division was seted up at 1980 and have an effective quality management system more than 20 years. Our COB is produced in class 10000 clean room and ESD prevented production area. Sevarl electronic products are produced with COB process, including keyboards, wireless mouse, LCD modules. Bonding Division has been certified by many international company and all products consist to RoHS standard at 2004. |
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